Loading Events

« All Events

European Test Symposium 2021 – Virtual

24 May 2021-28 May 2021

Siemens are pleased to be a corporate supporter of the European Test Symposium (ETS) 2021 which is taking place online from 24 to 28 May 2021.

The IEEE European Test Symposium (ETS) is Europe’s premier forum dedicated to presenting and discussing scientific results, emerging ideas, applications, hot topics and new trends in the area of electronic-based circuits and system testing, reliability, security and validation.

Please visit our Siemens EDA virtual exhibition booth during the event and learn how Tessent silicon lifecycle solutions provide IP and applications that detect, mitigate and eliminate risks throughout the IC lifecycle, from the design-for-test phase through continuous IC monitoring.  Reach out to the team to hear how Tessent helps customers address their debug, manufacturing test, yield, functional safety, IC security, and optimization requirements for today’s most complex SoCs.

Also we have a number of presentations taking place during the event, including a Vendor Session on Wednesday 26 May – ‘Siemens Presents Tessent Streaming Scan Network (SSN): No-Compromise DfT’ by Geir Eide.

Here are the sessions that Siemens are participating in during ETS 2021…

Monday 24 May

15:30-16:00 – Special Session 1: Exploring and Comparing IEEE P1687.1 and IEEE 1687 Modeling and Implementation of NON-TAP Interfaces
– Organizers: Martin Keim, Jeff Rearick

15:30-16:00 – Industry Session 1 – Diagnosing Failing Mixed-Signal ICs
– Organisers – Wim Dobbelaere, Steve Sunter

17:00-18:00 – Industry Session 2 – Solutions for preventing latent defects from causing system faults
– Organisers: Wim Dobbelaere, Steve Sunter

Tues 25 May

15:00-16:00 – Industry Session 3 – Analog Defect Simulation in Industry
– Organisers: Wim Dobbelaere, Steve Sunter

Wed 26 May 

15:00-16:00 – Embedded Tutorial 3 – Analog Test Automation – An Overview of IEEE P1687.2
– Organisers: Hans Martin von Staudt, Steve Sunter

18:50-19:10 – Session 10 – Non-Volatile Memories
MBIST-based Trim Adjustment to Compensate Thermal Behavior of MRAM
– Christopher Munch, Jongsin YUN, Martin Keim, Mehdi Tahoori

19:10-19:30 – Session 10 – Non-Volatile Memories
Convolutional Compaction-Based MRAM Fault Diagnosis

18:50-19:10 – Vendor Session 5: Electronic Design Automation and DFT
Siemens presents Tessent Streaming Scan Network (SSN): No-Compromise DFT – Geir Eid

Click to view the event program

To pre-arrange to connect with the team during the event, please email Jo Windel – jo_windel@mentor.com – who would be pleased to arrange this.

To find out more about the event and to book your place, please visit the event website.


24 May 2021
28 May 2021
Event Tags:
, , , , ,